JPH0749795Y2 - キャリアテープ - Google Patents
キャリアテープInfo
- Publication number
- JPH0749795Y2 JPH0749795Y2 JP1989050197U JP5019789U JPH0749795Y2 JP H0749795 Y2 JPH0749795 Y2 JP H0749795Y2 JP 1989050197 U JP1989050197 U JP 1989050197U JP 5019789 U JP5019789 U JP 5019789U JP H0749795 Y2 JPH0749795 Y2 JP H0749795Y2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- insulating tape
- dummy
- carrier tape
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000001028 reflection method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989050197U JPH0749795Y2 (ja) | 1989-05-01 | 1989-05-01 | キャリアテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989050197U JPH0749795Y2 (ja) | 1989-05-01 | 1989-05-01 | キャリアテープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142569U JPH02142569U (en]) | 1990-12-04 |
| JPH0749795Y2 true JPH0749795Y2 (ja) | 1995-11-13 |
Family
ID=31568540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989050197U Expired - Lifetime JPH0749795Y2 (ja) | 1989-05-01 | 1989-05-01 | キャリアテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749795Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2629502B2 (ja) * | 1991-11-20 | 1997-07-09 | 富士通株式会社 | 半導体チップ搭載フィルムの接続方法 |
| JP2006019450A (ja) * | 2004-06-30 | 2006-01-19 | Sumitomo Metal Micro Devices Inc | 回路基板及び実装後基板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826544Y2 (ja) * | 1979-11-20 | 1983-06-08 | 松下電器産業株式会社 | フレキシブル印刷配線板 |
| JPS6169161A (ja) * | 1984-09-12 | 1986-04-09 | Matsushita Electric Ind Co Ltd | フイルムリ−ド |
| JPS6232551U (en]) * | 1985-08-13 | 1987-02-26 |
-
1989
- 1989-05-01 JP JP1989050197U patent/JPH0749795Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02142569U (en]) | 1990-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |